The Module Backframe

To Do List

Task

Completion Date

Status

Consulting with Dan Peterson

06/08/09

Completed

Designing the Backframe

07/09/09

Completed

Producing the first prototype

14/10/09

Completed

Surveying the produced backframe

11/12/09

Completed

Producing the mounting bracket

13/11/09

Completed

Producing a dummy module

RV & SC

Ordering the O-Ring

RV & KD

02/11/09

Started

Backframe design modifications

Add a dowel hole for alignment

RV

Add screwholes to fix the frame

RV

Get a few G10 empty PCBs to test the glueing

Get a few nylon, teflon and other materials screw

Test the screwing

Status Summary

We took the opportunity to produce this new backframe because we lacked new spares and we decided to try and improve the original design. The new backframe of the DESY GEM Module has been designed to increase the available surface on the connector side. The consulting with the designer of the original device, Dan Peterson from Cornell, gave us confidence that this improvement could infact be done without reducing the functional effectiveness of the backframe.

We designed the backframe and consulted with the Hamburg University Workshop to actually produce the device. The feedback received from the workshop led to some minor modification to the design. However the HH Uni. Workshop didn't had in its availability the specific alloy previously used for the production of this element nor had the capability to perform the cold shocks required for the stress relief process. We decided anyway to try and produce a first prototype to check whether the lack of these feature will impare the effectiveness of the device.

By the end of Oct. 2009 the first prototype of this backframe has been produced and we proceeded with the surveying of this new device. The surveyed, performed in the Desy Central Workshop showed

The next step will be to survey the produced backframe to check for its conformity with the specification. Once we complete the survey, if the backframe is confirmed to be ok we plan to use it to produce a dummy module for the LPTPC to test the gas tightness and the precision of this component.

To produce the dummy module we need to build the sealing plate for the backframe so that the total thickness will finally be 45 mm. Moreover this sealing plate should have a copper layer on the Drift side to be put at the same voltage level of the other dummy modules. We decided to build this sealing plate with plexiglass, which is cheap, easily available at the HH Uni. Workshop, and easy to machine, with a glued copper layer on top.

Finally to have a working module we also need to build the mounting bracket to fix the module in position and provide the O-Ring to ensure its gas tightness. Both elements were not

DesyModBackframe (last edited 2010-05-19 19:04:20 by StefanoCaiazza)